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Applied RF Techniques for Modern Radio Design Training Course.

Reference Number: 564 Dates : Venue : Dallas Texas, USA

Send me an email about the next course as I cannot make this date and/or location.


Objectives | For whom intended | Outline | Lecturer | Registration |

Training Course Summary:

This 5-day course provides technical professionals with the design concepts required to optimize the RF performance of digital and software defined radio systems. This course will include a brief introduction to RF system performance requirements for both GSM and WCDMA handsets, and then it will transition into the RF design techniques used to maximize the RF performance of digital radio chip sets.

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Learning Objectives

Upon completing the course, the participant will be able to:

  • Understand Modern RFIC Architectures
  • Describe RF circuit parameters and terminology.
  • State the effects of parasitics on circuit performance at RF.
  • Use graphical design techniques and the Smith Chart.
  • Match impedances and perform transformations.
  • Understand key active circuit design issues
  • Review component and packaging technologies
  • Develop implementation strategies on RFIC integration and layout
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Target Audience:

The course is designed for practicing engineers who are involved with the production, test, and development of RF/Wireless components, circuits, sub-systems, and systems. It is equally useful to new engineers and to those who may have practical experience but have not had opportunity of getting a thorough foundation of modern, computer-oriented RF techniques.

Engineering degree or at least three years applicable practical experience is recommended.

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Training Course Outline

Day One

Digital Radio Overview
• Digital techniques used to build analog functions • RFIC goes standard digital CMOS • IC performance limitations • Digital radio system design Challenges • Key Specifications
RF Waves Defined
• RF Issues (at what frequency does RF start?) • Electromagnetic energy • The frequency spectrum
Mismatches
• Defining waves and how they propagate • Conversion to dB scale, dB, dBc, dBm, etc. • Two and three terminal impedance/admittance parameters • Reflection coefficient, VSWR • Return Loss and mismatch loss • Multi-connection mismatch losses (PCB’s,) • Defining Mismatch loss for 3-port devices (Baluns, filters, etc.) • Modeling and measuring mismatch losses • The relationship between insertion loss and mismatch loss

Day Two

The Smith Chart
• Maximum Power transfer • Applications of a smith chart • Impedance & admittance transformations • Transmission line manipulations • Defining the Q of a circuit and its effect on bandwidth • Optimizing the performance (gain, noise figure, IP2, IP3) of a device using the smith chart
Scattering Parameters
• Defining Scattering parameters • Review of one-port, parameters • Cascaded connections and de-embedding • Mixed Mode S-parameters • Measuring Single ended and Mixed mode S-parameters • Converting single ended S-parameters to Mixed mode S-parameters
Impedance Matching Techniques
• Power flow in two port networks • Maximum power transfer • Single section matching techniques • Bandwidth and parasitics considerations • System Integrating matching techniques • Optimizing the PCB layout for maximum power transfer

Day Three

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Lumped RF Component Models
• Chip resistors, capacitors and inductors • Resonating effects • Package parasitics
RFIC Package Models
• Small outline packages (SOIC, SSOP, TSSOP, etc.) • Quad flat pack and dual inline • Quasi-static EM field Simulations • De-embedding package parasitics
Transmission Line and PC-Board Ground Parasitics
• Via Holes (buried, blind, etc) • Optimum ground modeling techniques • Multilayer PC-boards • PCB interconnects • PC-board materials • Transmission line analysis • Transmission line modeling software
Component Technologies
• Surface Acoustic Wave filters (SAW) • Bulk Acoustic Wave filters (BSAW) • GaAs FET and micromechanical switches (MEMS) • Filter performance : selectivity, phase and amplitude distortion, etc. • Switch linearity and losses • Duplexing techniques

Day Four

Active Circuits - Performance Requirements
• Amplifier performance limitations • Thermal noise and noise floor definitions • Harmonic distortion • Single tone and multi-tone dynamic range • BLOCKING dynamic range • Sensitivity and Selectivity • Phase Noise
Active RF Circuit Design
• Arbitrary gains • Optimum matching techniques : gain, NF, power, IP2/IP3, etc. • Stability of cascaded amplifiers • Feedback Vs cascaded loading • Linear Vs nonlinear design considerations • Matching network topologies • AM suppression, high dynamic range • Balanced amplifier design examples at 1.9 GHz (GSM & WCDMA)

Day Five

Low Noise Amplifiers
• Balanced Vs single ended design requirements • Defining RF parameters for different receiver architectures • Trade-offs between gain, noise performance and dynamic range • Optimum PCB layout techniques • De-embedding front end losses : baluns, filters, switches, etc. • Second–order nonlinearity effects • RF to baseband interfacing (Sigma-Delta ADC’s)
RFIC Integration Design Issues
• Digital signal interference into RF front ends • TX noise in RX bands • DCXO signal coupling • Package parasitics and interconnects • Power consumption and power budgeting • Low voltage performance (goal 1.0 V)
Component Technologies RFIC
• CMOS, small size, low cost, adequate RF performance • SiGe, High ft low power consumption • Packing ball grid arrays (BGA’s) • Power amplifiers : HBT GaAs, Silicon MOS, GaAS FET, CMOS
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About the Lecturer

Rick Fornes pictureRick Fornes
Rick Fornes has twenty years of hands-on experience as an RF/Microwave Engineer, Program Manager, Engineering Director and Consultant, with companies such as Nokia, Lucent, Trimble Navigation and Plantronics. Initially his interest was focused on designing low-noise, broadband, and power amplifiers for military communication systems. Later his interest expanded to complete RF systems for commercial radio products and was involved in the design and development of low-cost RF circuits and sub-systems for wireless products. He also consults as a Technical Trainer for a number of telecommunication companies. During the past five years he has taught nearly 200 courses worldwide on RF circuit and system design, as well as RF test and measurements. He has put together numerous conference papers on RF-related topics, dealing with the design of power amplifiers and low-cost wireless systems. Mr. Fornes is a licensed amateur radio operator.

  • 20 years of innovative RF circuit design, system design and engineering management
  • Licensed amateur radio operator since 1971
  • Member of IEEE, Eta Kappa Nu, The EE Honor Society and ARRL
  • Patents pending (advanced RF system architectures)
  • Member of Who's Who National Register's (2002-2003)
  • Member of Technical Advisory Board for Besser Associates, an RF international training company
  • BSEE, advanced studies in microwave circuits, system engineering and business management
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Further Information

  • Date : The next Public presentation is17-21 November, 2008
  • Fee : Register by 13th October/2008 and pay $US1995, otherwise pay $US2195 per student (or equivalent in Local Currency). Payment in advance via Credit Cards (PayPal or Google Checkout below), Cheque or bank transfer (ask for transfer details).
  • Venue : Dallas Texas, USA
  • Registration : To register for this course please fill in your details on the form below and submit it.

Further Information

  • For Further Information on this Training Course: such as Dates, Venue, Prices etc. please fill in your details on the form below and click the "submit" button.

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