COOLING TECHNIQUES FOR ELECTRONIC EQUIPMENT Training Course

This "cooling techniques" course will show designers and engineers quick methods for designing electronic equipment to withstand severe thermal environments without failing.

Course Content

Various Types of Electronic Enclosures

• Various Types of Electronic Enclosures
• Sheet Metal Assemblies
• Dip Brazed Chassis With Convoluted Fin Heat Exchanger
• Investment Cast Chassis With Pin Fin Heat Exchanger
• Numerical Control Milling For Electronic Boxes
• Die Cast Small Electronic Enclosures
• Screw And Glue Electronic Boxes
• Humidity And Moisture Drain Hole Requirements
• RFI And EMI Problems With Some Types Of Boxes
• Sealed Electronic Boxes, Good And Bad

Mounting Various Types Of Components On Circuit Boards

• Problems With Surface Mounting Leadless Chip Carriers
• Adding Thermal Compression Bonded J Leads To Chips
• Vapor Phased Soldering S Wires To Surface Mounted Parts
• Problems With Surface Mounting Transformers
• Avoiding Cracking of Chip Resistors and Capacitors
• Surface Mounting Ball Grid Arrays
• Surface Mounting Large Multi Chip Modules
• Surface Mounting Large Fine Pitch Leaded Components
• Problems With Through Hole Mounting Pin Grid Arrays
• Problems With Through Hole Mounting Small Axial Leaded Resistors
• Various Types Of Lead Wire Strain Relief To Prevent Solder Failures
• Avoid Flush Mounting On Through Hole Components
• Case Histories of Successes and Failures

Effective Natural Convection And Radiation Cooling

• Adding External Fins on a Box To Improve Cooling
• Cooling Vertically Oriented Circuit Boards
• Cooling Horizontally Oriented Circuit Boards
• Making Effective Use Of Extruded Fin Heat Sinks
• Methods For Increasing Convection And Radiation Coefficients
• Combining Convection And Radiation Cooling
• Effects of Solar Energy on Outdoor Electronics
• Solar Radiation and Albedo Effects
• Cooling for Orbiting Satellites
• Adding Cooling Fins on Hot Components
• Natural Cooling Methods for Enclosed Box
• Required Spacing Between Circuit Boards for Good Cooling
• How Altitude Effects Natural Convection Cooling
• Many Sample Problems To Demonstrate Practical Applications

Methods For Improving Forced Convection Cooling

• Various Types of A/C and D/C Cooling Fans
• Typical Problems with Improper Fan Installation
• How To Determine and Cure Short Circuit Cooling Air Flow Path
• Air Flow Properties of Fans and Blowers
• Calculating Pressure Drops Through A Chassis
• Matching the Impedance Curves for Chassis and Fan
• Understanding Static, Velocity and Total Pressure
• Flow Losses Due to Entrance, Exit, Expansion and Turns
• Cooling Air Flow from an Environmental Control System
• Effects of Altitude on Mass Flow and Pressure Drop
• Working with Sigma Delta Pressure Drop
• Convoluted Fin and Pin Fin Heat Exchanger Performance
• Many Sample Problems to Illustrate Cost Effective Applications

Practical Conduction Cooling Design Guidelines

• Concentrated and Uniform Heat Load Temperature Rise
• One and Two Dimensional Heat Flow
• Using Internal Ground and Voltage Planes to Spread Heat
• Simple Methods for Adding Circuit Board Heat Sinks
• Improving Thermal Conductivity of Potting Materials
• Evaluating Thermal Resistance Across Bolted Interfaces
• Effects of Surface Finish, Hardness and Pressure on Interface Resistance
• Effects of Altitude on Interface Resistance
• Thermal Resistance Across Different Board Edge Guides
• Thermal and Vibration Problems with Wedge Clamp Guides
• Simple Analog Thermal Resistor Networks for Complex Problems
• Tracing a Heat Conduction Path from Heat Source To Sink
• Mounting High Power Components on Circuit Boards
• Many Sample Problems to Promote Better Understanding

Practical Design And Analysis Guidelines

• How to Avoid Common Heat Pipe problems
• Various Liquids for Improved Cooling
• Chimney Equations for Improved Cooling of Large Cabinets
• Series-Parallel Air Flow Networks
• Humidity and Moisture Effects
• Effects of Various Types Of Conformal Coatings
• Environmental Stress Screening Guidelines
• Thermal Expansion Equilibrium Equations, Lead Wires, Solder
• Slow Thermal Cycling Solder Creep Forces, Stresses, Fatigue Life
• Case Histories to Promote Improved Electronic Design

Who should attend

This Cooling Techniques training course will benefit designers, engineers and managers from all the following functions:

• R&D Electronic Engineers & Managers
• Packaging Engineers
• Quality & Reliability Engineers
• Test Engineers
• Manufacturing Engineers
• Application & Sale Engineers.

About the Lecturer

Dave S. Steinberg - is a well-known author and internationally recognized authority on the mechanical design, analysis, testing and packaging of cost effective sophisticated electronic equipment that must work with a high degree of reliability in harsh thermal, thermal cycling, vibration and shock environments. He has been involved in these areas related to commercial, industrial and military applications for many years. He recently retired from Litton Industries, where he was the manager of the Engineering Department for 15 years.
Mr. Steinberg is a visiting professor at the University of Wisconsin and for the past several years at UCLA where he has been presenting full semester post-graduate courses on similar electronic subjects related to the reliability of electronic equipment.
Mr. Steinberg has worked on many aircraft/missile/space programs, ships' electronic systems, automotive electronics and computers. These include the F-14, F-15, F-16, F-22, cruise missile, AMRAAM, ALCM, TALCM, SLCM, Titan 2 and 3, space shuttle, Mercury, Gemini, Apollo, communications satellites, DD963 destroyers, and the USS Forestall aircraft carrier. Typical companies include Lockheed, IBM, Litton, Intel, GM, Ford, Boeing, Wright Patterson AFB, Northrop, Cisco, Harris, United Aircraft, Hamilton Standard and Motorola, just to name a few.

Registration

• On line
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• Off line
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